Solder POS61M

Designation

Name The value
Designation GOST Cyrillic ПОС61М
Designation GOST Latin POC61M
Transliteration POS61M
By chemical elements ПSnPb61Cu

Description

Solder POS61M used: for the production of ingots, round wire, round rods filled with flux tubes, powder used for tinning and soldering electrosolderers thin (thickness less than 0.2 mm) copper wires, foil, printed conductors in the cable, the electrical and electronic industry.

Note

Tin-lead solder-copper and antimony free. The use of solder for tinning and soldering in the crucible and the bath is not allowed.

Standards

Name Code Standards
Non-ferrous metals, including rare, and their alloys В51 GOST 21930-76, GOST 21931-76, GOST 28873-90

Chemical composition

Standard S Ni Fe Cu As Al Zn Sn Sb Pb Bi
GOST 21930-76 ≤0.02 ≤0.02 ≤0.02 1.2-2 ≤0.01 ≤0.002 ≤0.002 59-61 ≤0.2 Rest ≤0.1
Sn is the basis.

Mechanical properties

σU, MPa d KCU, kJ/m2 HB, MPa
Pig in the state of delivery
≥44.15 ≥40 ≥107.8 ≥14.9

Description mechanical marks

Name Description
σU Limit short-term strength
d Elongation after rupture
KCU Toughness
HB Brinell hardness number

Physical characteristics

Temperature r, kg/m3 l, W/(m · °C) R, Mr. · m
20 8500 4899 143

A description of the physical symbols

Name Description
l Coefficient of thermal conductivity
С Specific heat